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[Cutting/Processing Method Introduction] Slicer Cutting Processing

Cutting accuracy is ±0.01mm! We can also handle strip cutting, individual piece cutting, deep groove processing, and wide groove cutting.

Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, high precision processing can be achieved. "Slicer cutting processing" involves bonding with WAX suitable for the product and processing conditions, allowing for strip cutting, individual piece cutting, deep groove processing, and wide groove cutting to match patterns and product edges. The main processing materials include alumina, aluminum nitride, piezoelectric ceramics, and glass materials. 【Work Size】 ■ Maximum: 250×160×15.0mm ■ Minimum cutting dimension: 0.5mm ■ Deep groove specification slicer: t40.0mm, groove depth up to 35.0mm ■ Cutting precision: ±0.01mm～ *For more details, please refer to the PDF document or feel free to contact us.